TechConnect Innovation World and National Summit

22 November 2016

The TechConnect World Innovation Conference being held in Washington DC (May 23-25), is an annual event uniquely designed to accelerate the commercialization of innovations out of the lab and into industry. The Technical Program spotlights applications focused innovations, materials and devices emerging from industrial, government and academic laboratories worldwide. The Innovation Partnering Program gathers market-ready, commercially-viable, innovations into the largest global technology accelerator program.

Dotz Nano was invited to participate in the Summit and to give a presentation to the Summit forum on Dotz technology. Only 14 companies were selected to present their technology. In addition, Dotz was selected as one of the TechConnect Innovation Awardees for 2016. Over 800 companies submitted their application to the Summit with only 5% receiving the Innovation Award.